Vacuum Brazing of Silicon Nitride–Tungsten Electrode Silver Contact

Vacuum brazing is a reliable and precise joining method for manufacturing silicon nitride–tungsten electrode silver contacts, which are widely used in high-performance electrical, electronic, and power-control applications. This process enables the successful bonding of ceramic and metal materials that cannot be joined by conventional welding techniques.

In this process, a high-temperature vacuum brazing furnace is used to create an oxygen-free environment, preventing oxidation and contamination during heating. A specially designed active brazing alloy, typically containing silver and an active element such as titanium, is placed between the silicon nitride ceramic and the tungsten electrode. When heated to the brazing temperature, the filler metal melts and chemically interacts with the ceramic surface while metallurgically bonding to the metal components.

The vacuum brazed joint provides excellent electrical conductivity, high thermal stability, and strong mechanical integrity. Silicon nitride offers superior insulation, wear resistance, and thermal shock resistance, while tungsten ensures high-temperature strength and durability. The silver contact layer further enhances conductivity and contact reliability.

As a result, vacuum brazed silicon nitride–tungsten electrode silver contacts deliver long service life, stable performance, and high reliability, making them ideal for demanding electrical and industrial applications.