Vacuum brazing of graphite and copper

Vacuum brazing of graphite and copper is a specialized joining process used in high-temperature, high-thermal-conductivity applications such as semiconductor equipment, heat sinks, EDM components, and aerospace thermal assemblies. Graphite offers excellent thermal stability and low thermal expansion, while copper provides outstanding heat transfer, making their combination ideal for advanced thermal management solutions.

Because graphite is non-metallic and chemically inert, vacuum brazing is performed using active or specially alloyed brazing fillers that promote wetting and strong interfacial bonding with both graphite and copper. The vacuum environment prevents oxidation, ensures clean joint interfaces, and produces flux-free, high-integrity bonds. The resulting assemblies exhibit excellent thermal conductivity, mechanical reliability, and resistance to thermal shock, enabling long-term performance in demanding operating conditions.