Vacuum Brazing of AMB (Active Metal Brazing) Ceramic Copper Clad Laminate

Vacuum brazing of AMB (Active Metal Brazing) ceramic copper clad laminate is a critical process used in the production of high-performance power electronic substrates. These laminates are widely applied in electric vehicles, renewable energy systems, power modules, and high-voltage industrial equipment due to their excellent thermal conductivity and electrical insulation.

In the AMB process, a ceramic substrate—such as aluminum nitride (AlN) or alumina (Al₂O₃)—is bonded to copper plates using an active brazing alloy containing elements like titanium. The assembly is processed in a high-vacuum brazing furnace, where the oxygen-free environment prevents oxidation and enables the active element to chemically react with the ceramic surface. This creates a strong metallurgical bond between the ceramic and copper without the need for flux.

Vacuum brazing ensures uniform bonding, high joint strength, and excellent thermal performance across the entire laminate area. The resulting AMB ceramic copper clad laminates offer superior heat dissipation, high electrical reliability, and excellent mechanical stability, even under high current and thermal cycling conditions.

Due to these advantages, vacuum brazed AMB substrates are essential components in modern high-power and high-reliability electronic applications.